MicroSD Card 3TE4
产品特色
Compliant with SD 6.1/ SD 3.0/ SD 2.0interface
Support Class 10 with UHS-III
Adopt 3D TLC NAND flash
High performance
Targeted for portable and stationary applications
SMART function supported
介绍:
宜鼎国际MicroSD 3TE4支持class 10 UHS-I ,专为IPC及嵌入式应用所设计。提供32GB到512GB容量,并有着卓越质量的TLC NAND Flash,且完全符合SD3.0以及SD2.0的规格。
3.0系列SD卡拥有最新的固件架构及Flash算法,包括优秀的平均磨耗损与读取干扰管理,可实现最高程度的可靠性及耐久度。再结合低功耗的特点,宜鼎国际MicroSD 3TE4系列尤其适合应用在工业自动化、SBC(单板计算器)、医疗设备以及移动设备上。
规格:
|
Module Name |
MicroSD Card 3TE4 |
|
Interface |
SD 6.1, SD 3.0 |
|
Flash Type |
3D TLC |
|
Capacity |
32GB~512GB |
|
Sequential R/W (MB/sec, max.) |
90/80 |
|
Max. Power Consumption |
0.7W |
|
Max. Channels |
1 |
|
S.M.A.R.T. |
Y |
|
Dimension (WxLxH/mm) |
11.0 x 15.0 x 1.0 |
|
Vibration |
20G@7~2000Hz |
|
Shock |
1500G@0.5ms |
|
MTBF |
>3 million hours |
|
Storage Temperature |
-40°C ~ +85°C |
产品料号:
|
Operation Temp. |
32GB |
64GB |
128GB |
256GB |
512GB |
|
Standard Grade (-25°C ~ +85°C) |
DESDM-32GS06EE1SL |
DESDM-64GS06%E1SL |
DESDM-A28S06%E1SL |
DESDM-B56S06%E1SL |
DESDM-C12S06%E1SL |
|
Industrial Grade (-40°C ~ +85°C) |
DESDM-32GS06EW1SL |
DESDM-64GS06%W1SL |
DESDM-A28S06%W1SL |
DESDM-B56S06%W1SL |
DESDM-C12S06%W1SL |
%. G: 96 layers 3D TLC; K: 112 layers 3D TLC

